Thermally Conductive Silicones

Thermally Conductive Gels

To meet manufacturing needs, Silicone Solutions offers both one and two component gels from Momentive with a variety of viscosities and curing mechanisms to allow for varying times and temperatures. Some gels are thermally stable to 200°C and provide protection from external shock and vibration, dielectric protection and a dampening effect for components. Detailed property information is available from the following brochure

Thermally Conductive Silicone Grease Compounds

Momentive’s thermally conductive SilCool grease compounds offer excellent thermal conductivity, as well as excellent stability, penetration, temperature
resistance, and low bleed. These properties enable SilCool grease compounds to draw heat away from devices, contributing to improved reliability and operational efficiency of electronic components.
The combination of processing performance and thermal conductivity that these grease compounds offer makes them good candidates for thermal interface applications in a wide range of high performance devices and packages.

Thermally Conductive Silicone Adhesives

Momentive Performance Materials developed its family of SilCool thermally conductive adhesives to help deliver thin bond lines, which contribute to low thermal resistance while providing excellent adhesion and reliability. This series of heat-cured adhesives excel in thermal interface applications that demand good structural adhesion.
Examples include spreaders and heat generators, and thermal interfaces to heat sinks in TIM2 applications. Additional thermal adhesives from Momentive offer the
process convenience of 1-Part condensation cure with moderate heat dissipation. Target applications include board assemblies and sealants in power modules and sensors.

Thermal Gap Filler Liquid Dispensed Pad

Momentive’s thermally conductive Gap Fillers are non-slumping, dispensable materials that can be applied to gaps to create a heat path. These non-adhesive
curing type TIMs form a soft, stress-absorbing thermal interface. In addition to filling gaps in electronic components, they can be applied to flat or high-profile
3-dimensional surfaces as a cure-in-place thermal pad or as a pump-out resistant alternative to greases.

Thermally Conductive Encapsulants and Potting Compounds

Momentive Performance Materials offers a variety of heat or room temperature cure, thermally conductive encapsulants that help remove heat from critical
components. This selection of grades cures to form a soft rubber, gel material, and consists of low-viscosity grades for potting applications, as well as grades with moderate viscosities that provide the necessary dispense stability for bead formulation. This category of thermal products also includes grades that can be considered for use as gap fillers or as liquid dispensed alternatives to thermal pads.