Lithography technology plays a vital role in semiconductor manufacturing. In recent years, with the advancement of science and technology, significant developments have been achieved in many aspects.
Lithography technology plays a vital role in semiconductor manufacturing. In recent years, with the advancement of science and technology, significant developments have been achieved in many aspects. Here are some of the major advances in wafer lithography:
1. Progress in extreme ultraviolet (EUV) lithography technology
- Wavelength shortening: The most advanced EUV lithography machine currently uses extreme ultraviolet light sources with a wavelength of 13.5 nanometers, which can achieve chip manufacturing with 5 nanometer or even 3 nanometer processes. This technological breakthrough enables semiconductor manufacturing to be performed on smaller nodes, significantly improving chip integration and performance.
- Single exposure efficiency: Compared with traditional multiple exposure processes, EUV technology can achieve higher resolution through a single exposure, which not only reduces production time but also reduces costs.
2. High numerical aperture (High-NA) lithography technology
- Improving resolution and efficiency: A new generation of High-NA EUV lithography machine is under development. This equipment can further improve lithography accuracy and efficiency and is suitable for advanced processes below 2 nanometers. This technology will provide the possibility to create smaller and more complex chips.
3. Multi-layer lithography technology (ML2)
- Breaking through the resolution limit: Multilayer lithography technology aims to further break through the resolution limit through multi-layer coating and exposure, which is of great significance for promoting the development of semiconductor manufacturing.
4. Research and development of new light sources
- FEL light source: Free electron laser (FEL) light source based on energy recovery linear accelerator (ERL) is considered to be a new option for future lithography technology. FEL light sources have advantages in terms of power, energy conversion efficiency, and cost, and are expected to enable more efficient patterning in the future.
5. Technology gap and catch-up at home and abroad
- Development in China: Although China still has gaps in EUV lithography technology, some research institutions have proposed new fast optical proximity effect correction technology to improve imaging quality and reduce process difficulty. This shows that China is making progress in catching up with the global advanced level.
To sum up, wafer lithography technology is developing towards higher precision, lower cost and higher efficiency, which will have a profound impact on the semiconductor industry. As new technologies continue to emerge, future chip manufacturing will be more sophisticated and efficient.