The photolithography process is responsible for accurately transferring the designed circuit pattern to the wafer surface. This process uses a photolithography template and photoresist to form the desired circuit structure through ultraviolet light irradiation.
During the wafer manufacturing process, there are several key steps that are critical to the quality and performance of the final product. Among them, photolithography is widely considered to be one of the most critical steps.
- Pattern transfer: The photolithography process is responsible for accurately transferring the designed circuit pattern to the wafer surface. This process uses a photolithography template and photoresist to form the desired circuit structure through ultraviolet light irradiation.
- Determine the critical size: Any error in the photolithography process may cause pattern distortion or poor alignment, thereby affecting the electrical performance of the device. Modern production usually requires 30 layers or more of photolithography processes, so its accuracy and reliability are crucial.
Although photolithography is the most critical step, other steps are equally important:
1. Wafer processing: Including extracting high-purity silicon from silica sand and making wafers, which lays the foundation for subsequent processes.
2. Oxidation: Forming a protective film on the surface of the wafer to prevent impurities and leakage current.
3. Etching: Removing excess material and retaining only the required circuit structure.
4. Thin film deposition: Forming multi-layer structures by depositing different materials is essential for building complex semiconductor devices.
In summary, although photolithography is regarded as the most critical step in wafer manufacturing, every link in the entire manufacturing process has an important impact on the performance of the final product.