PCB Production Workflow

27 Mar.,2025

PCB, also known as printed circuit board in Chinese, is an important electronic component that serves as a support for electronic components and a carrier for the electrical interconnection of electronic components.

 

Author: Marisa

Every step of PCB production

1.Cutting:

Cut the entire copper-clad laminate with a certain thickness of board and copper foil into sizes that are easy to process, reducing weight by about 10-15%;


2.Drilling:

Drill conductive holes or sockets on the board according to the computer drilling program; The weight of the board has decreased by about 5%;


3.Copper deposition (electroless copper plating):

depositing a thin layer of chemical copper in a borehole. The thickness is about 0.3-2um, and the weight increase is relatively small. The purpose is to deposit a thin layer of chemical copper on a non-conductive epoxy glass cloth substrate (or other substrate) Deposition of a layer of copper through chemical methods to facilitate subsequent electroplating and conductivity, thereby forming lines;


4.Full board copper plating:

mainly thickening and protecting a thin layer of chemical copper to prevent oxidation in the air, resulting in no copper or holes in the holes;


5. Graphic production (graphic transfer printing): including inner layer graphic production, using graphic anti plating ink to stick dry film or screen print on the circuit board, and after exposure and development, producing circuit patterns; The weight reduction is minimal.

 

6.Graphic electroplating: Thickening and plating copper on a circuit board with completed graphic circuits to achieve a certain thickness of copper in the holes and circuits, which can carry a certain amount of current; Weight increased by approximately 15%;


7.Etching:

including inner layer etching, removal of graphic ink or dry film, etching off excess copper foil to obtain conductive circuit patterns;


8.Laminated:

The inner layer, prepreg, and copper foil are laminated together and pressed into a multi-layer board at high temperature. A 4-layer board requires an inner layer and two copper foils; A 6-layer board requires two inner layers and two copper foils. The weight of the 4-layer board increases by about 15-25%, and the weight of the 6-layer board increases by 30-40%;


9.Screen printing solder mask ink or adhesive solder mask dry film:

Print a layer of solder mask ink on the board, with a thickness of about 35um and a weight increase of about 2-4%; Alternatively, a layer of solder mask dry film can be applied, exposed, and developed. Form solder mask patterns;


10.Tin spraying:

Spray a layer of lead and tin on the area that needs to be soldered on the circuit board to facilitate soldering. It can also prevent the copper surface from being oxidized, which will increase the weight by about 1-2%;

 

11.Characters:

Print some iconic characters on the board with less weight increase, mainly for the convenience of downstream customers for installation;


Shape: The shape of the board is processed according to customer requirements, reducing weight by about 5-10%;